New Power for the Next Generation of Intelligent Terminals
Embodied intelligence — represented by humanoid robots and industrial-grade drones — is emerging as the next wave of terminal products after smartphones and new-energy vehicles, demanding power devices that combine miniaturization, lightweight design, and high energy efficiency. From joint servo drives and motor control to flight-control power management, embodied-intelligence systems are packed with power conversion and signal processing stages, each placing stringent demands on device efficiency, thermal dissipation, and fast response. Our semiconductor solutions — covering MOSFETs, IGBTs, modules, SiC devices, rectifiers, protection devices, and small-signal products in a wide range of power ratings and package forms — meet the diverse design requirements of products and control boards.
Precision Control, Long-Lasting Efficient Endurance
In humanoid robotics, highly integrated joint modules must deliver precise torque output and energy regeneration within a compact footprint, where the low-loss and high-switching-frequency characteristics of power semiconductors are critical. In industrial and consumer drones, electronic speed controllers (ESCs) and battery management systems (BMS) demand outstanding power density and wide-temperature operation. We continue to advance package miniaturization and chip performance iteration, delivering highly integrated, highly reliable power devices that help customers shrink product size, extend battery life, and improve motion-control precision — providing core semiconductor support for embodied-intelligence products.
